ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,808, issued on July 28, was assigned to MARVELL ASIA PTE LTD (Singapore). "Carrier die with micro channel cooling and embedded components" ... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,809, issued on July 28, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Method for manufacturing semiconductor module" was inven... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,810, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Package structure and method fo... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,811, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Won I... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,812, issued on July 28, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device" was invented by Tomohira Kikuchi (Kyoto, Japan... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,813, issued on July 28, was assigned to FOSHAN NATIONSTAR OPTOELECTRONICS Co. LTD. (Foshan, China). "Method for manufacturing an optoelectr... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,814, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Young... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,815, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and a method of manufa... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,816, issued on July 28, was assigned to Adeia Semiconductor Inc. (San Jose, Calif.). "Systems and methods for releveled bump planes for chi... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,817, issued on July 28, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Three-dimensional stack package structure w... Read More